詳細(xì)介紹

型號6000 FSA用于生產(chǎn)的全自動，上側(cè)或后側(cè)光刻機

用于：半導(dǎo)體，MEMS，傳感器，微流體，IOT，包裝
憑借在半導(dǎo)體行業(yè)40多年的制造，OAI滿足了***個新的精英階段的生產(chǎn)光刻設(shè)備的動態(tài)市場的日益增長的挑戰(zhàn)。

建立在著名的OAI模塊化平臺上，6000系列具有完全自動化的亞微米分辨率的頂側(cè)或背側(cè)對齊，提供無與倫比的性價比。

對準(zhǔn)器具有的光束光學(xué)，在***個掩模模式下具有優(yōu)于±3％的均勻性和每小時180個晶片的吞吐量，這導(dǎo)致更高的產(chǎn)量。 6000系列可以處理厚和粘合基板（高達(dá)7000微米），翹曲晶片（高達(dá)7 mm-10mm），薄基板（低至100微米厚）和厚光致抗蝕劑的各種晶片。

具有卓越的工藝重復(fù)性，6000系列是所有生產(chǎn)環(huán)境的完美解決方案。選擇頂部或可選的背面對齊，使用OAI的基于Cognex的自定義模式識別軟件。對于總體光刻工藝，Series1 6000可以與集束工具無縫集成。 OAI的新生產(chǎn)面罩對齊器是總包。

 

好處

•全自動
•側(cè)面對齊
•可選：底部對齊
UV到NUV
•集群工具集成
•自定義軟件


規(guī)格

曝光系統(tǒng)
曝光模式真空接觸硬接觸軟接觸接近（2μ間隙）
高***光束
均勻梁尺寸：50mm - 200mm方形/圓
200mm-300mm見方/圓
均勻度：優(yōu)于±3％
相機：雙攝像頭與CCTV擴展的景深


對齊系統(tǒng)

模式識別CognexvisionPro¹™與OAI定制軟件
對準(zhǔn)精度0.5μ頂面
1.0μ，頂部到底部可選背面對齊
預(yù)對準(zhǔn)精度優(yōu)于±50μ
自動對齊頂部到底部
頂部


晶片處理

基材尺寸50mm-200mm圓形或方形或200mm-300mm圓形或正方形
薄晶片低至100M
翹曲晶片高達(dá)7mm-10mm
厚和粘合基板高達(dá)7000μ
機器人單臂和雙臂晶片處理
失步補償標(biāo)準(zhǔn)軟件或可選的熱卡盤
晶片尺寸轉(zhuǎn)換5分鐘以內(nèi)
吞吐量掩模每小時180個晶片 - 隨后75-100個晶片每小時
楔形效果平整3點或可選非接觸

 

可用選項

IR自動對齊，
盒式磁帶映射
365nm LED曝光光源
溫度控制晶片卡盤
集成屏蔽管理控制
用于全光刻的集成光刻集群
使用SMIF或FOUP接口模塊的過程環(huán)境控制
非接觸式調(diào)平
邊緣夾緊
 

Model 6000 FSA Fully Automated, Topside or Backside Mask Aligner for Production
 
For: Semiconductors, MEMS, Sensors, Microfluidics, IOT, Packaging
With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with a new elite class of production photolithography equipment.

Built on the venerable OAI modular platform, the Series 6000 has topside or backside alignment that is fully automated with sub-micron resolution which delivers performance that is unmatched at any price.

The Aligners have Advanced Beam Optics with better than ±3% uniformity ａnd a throughput of 180 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick ａnd bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), ａnd thick photo resist.

With superb process repeatability, the Series 6000 is the perfect solution for all production enviroments. Choose either top side or optional back side alignment which uses OAI＇s customized pattern recognition software that is Cognex based. For the total lithography process, the Seriesl 6000 can be integrated seamlessly with cluster tools. OAI＇s new production mask Aligners are the total package.

BENEFITS

• Fully Automated
• Topside Alignment
• Optional: Bottomside Alignment
• DUV to NUV
• Cluster Tool Integration
• Customized Software
SPECIFICATIONS

Exposure System
Exposure Modes Vacuum contact Hard contact Soft contact Proximity (2μ gap)
Advanced Beam Optics
Uniform Beam Size: 50mm - 200mm square/round
  200mm - 300 mm square/round
Uniformity: Better than ±3%
Camera: Dual Camera with CCTV with Expanded Depth of Field

Alignment System
Pattern Recognition Cognex visionPro¹™ with OAI customized software
Alignment Accuracy 0.5μ topside
  1.0μ with top to bottom optional backside alignment
Pre-alignment Accuracy Better than ±50μ
Auto-alignment Top to bottomside

  Topside

Wafer Handling
Substrate size 50mm – 200mm round or square or 200mm-300mm round or square 
Thin wafers Down to 100Μ 
Warped Wafers Up to 7mm-10mm 
Thick & Bonded Substrates Up to 7000μ 
Robotics Single ａnd dual arm wafer handling 
Run-out compensation Standard software or optional thermal chuck 
Wafer size conversion 5 minutes or less 
Throughput 1st mask 180 wafers per hour - subsequent 75-100 wafers per hour 
Wedge Effect Leveling 3 point or optional non-contact 
Available Options